New IBM Telum II Processor and IBM Spyre Accelerator unlock capabilities for enterprise-scale AI, including large language models and generative AI
Advanced I/O technology enables and simplifies a scalable I/O sub-system designed to reduce energy consumption and data center footprint
PALO ALTO, Calif., Aug. 26, 2024 /PRNewswire/ — IBM (NYSE: IBM) revealed architecture details for the upcoming IBM Telum® II Processor and IBM Spyre™ Accelerator at Hot Chips 2024. The new technologies are designed to significantly scale processing capacity across next generation IBM Z mainframe systems helping accelerate the use of traditional AI models and Large Language AI models in tandem through a new ensemble method of AI.
With many generative AI projects leveraging Large Language Models (LLMs) moving from proof-of-concept …