Semiconductor Advanced Packaging Market size to increase by USD 29.33 Billion between 2024 to 2029, Market Segmentation by Device, Technology, Geography , Technavio | PR Newswire [Video]

, /PRNewswire/ — The global semiconductor advanced packaging market size is estimated to grow by USD 29.33 billion from 2025 to 2029, according to Technavio. The market is estimated to grow at a CAGR of over 9.8% during the forecast period. The report provides a comprehensive forecast of key segments below- 

Segmentation Overview

1. Device 
   • 1.1 Analog and mixed ICs
   • 1.2 MEMS and sensors
   • 1.3 Logic and memory devices
   • 1.4 Wireless connectivity devices
   • 1.5 CMOS image sensors
2. Technology 
   • 2.1 Flip chip
   • 2.2 FI WLP
   • 2.3 2.5D/3D
   • 2.4 FO WLP
3. Geography 
   • 3.1 APAC
   • 3.2 North America
   • 3.3 Europe
   • 3.4 South America
   • 3.5 Middle East and Africa

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1.1 Fastest growing segment:

The Semiconductor Advanced Packaging Market experiences steady growth due to the increasing demand for modern electronic components with enhanced performance and functionality. Advanced packaging solutions, such as Flip-Chip, Embedded-Die, Fan-Out WLP, and FO WLP, are essential for …