, /PRNewswire/ — The global semiconductor advanced packaging market size is estimated to grow by USD 29.33 billion from 2025 to 2029, according to Technavio. The market is estimated to grow at a CAGR of over 9.8% during the forecast period. The report provides a comprehensive forecast of key segments below-
Segmentation Overview
- Device
- 1.1 Analog and mixed ICs
- 1.2 MEMS and sensors
- 1.3 Logic and memory devices
- 1.4 Wireless connectivity devices
- 1.5 CMOS image sensors
- Technology
- 2.1 Flip chip
- 2.2 FI WLP
- 2.3 2.5D/3D
- 2.4 FO WLP
- Geography
- 3.1 APAC
- 3.2 North America
- 3.3 Europe
- 3.4 South America
- 3.5 Middle East and Africa
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1.1 Fastest growing segment:
The Semiconductor Advanced Packaging Market experiences steady growth due to the increasing demand for modern electronic components with enhanced performance and functionality. Advanced packaging solutions, such as Flip-Chip, Embedded-Die, Fan-Out WLP, and FO WLP, are essential for …